Abstract
In this paper, Modified Embedded Atom Method (MEAM) method, one of the molecular dynamic (MD) methods, was utilized to investigate the wettability of Sn droplet on the copper plate to simulate the wetting and spreading phenomena of the solder process. And the experiment of spreading and wetting process of Sn droplet on the copper plate was performed by sessile-drop as well to get the contact angles. The results show that the MEAM method is fit to simulate the soldering process. Keywords: Wettability; Soldering; MEAM; Sessile-drop; Molecular dynamic
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