Abstract
Bidentate diamine and amino‐alcohol ligands have been used to form solid, water‐soluble, and air‐stable monomeric copper complexes of the type [Cu(NH2CH2CH(R)Y)2(NO3)2] (1, R=H, Y=NH2; 2, R=H, Y=OH; 3, R=Me, Y=OH). The complexes were characterized by elemental analysis, mass spectrometry, infrared spectroscopy, thermal gravimetric analysis, and single‐crystal X‐ray diffraction. Irrespective of their decomposition temperature, precursors 1–3 yield highly conductive copper features [1.5×10−6 Ω m (±5×10−7 Ω m)] upon atmospheric‐pressure plasma‐enhanced sintering.
Highlights
The market for printed electronics has seen steady growth over the last decade, as lower processing temperatures have facilitated a move to low-cost flexible materials.[1]
Inkjet printing of metallic features is fairly common place industrially; typically nanoparticle (NP)-based formulations are used.[2]. These “inks” consist of metal nanoparticles dispersed in a solvent that contains stabilizing agents and other substances to control the viscosity, consistency, and wettability of the ink.[3]
Sophisticated conditions are often required for their deposition onto substrates, as well as high temperatures for sintering (> 150 8C), which raises the cost and limits the range of suitable substrates.[4,5]
Summary
The market for printed electronics has seen steady growth over the last decade, as lower processing temperatures have facilitated a move to low-cost flexible materials.[1] High-quality and, low-electrical-resistance printed features that can replace electrical wiring in a range of devices, the shunting lines in organic light-emitting diodes (OLEDs), interconnects for photovoltaics, and the antennae in radio-frequency identification (RFID) devices, are in urgent need. Metal-organic decomposition (MOD) inks, as an alternative, provide potential for higher economic feasibility[6] and more widespread use. Owing to its lower cost and tendency for electromigration, with the passage of high electron current densities,[7] copper is an attractive alternative to other highly conductive metals, for example, silver.
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