Abstract
Experimental observations were conducted to investigate the effects of various parameters on the surface finish and SubSurface Damage (SSD) of ground silicon wafers. A novel design in wet chemical etching was proposed and implemented to provide wafers a means of strength enhancement while allowing the user to control the backside wafer surface finish. The results indicate that no propagating crystalline defect was accompanied, but leaving the wafer in a rather good surface integrity for back metal adhesion purposes.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: International Journal of Materials and Product Technology
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
