Abstract
Silicon carbide (SiC) is well known for its excellent material properties, high durability, high wear resistance, light weight and extreme hardness. Among the engineering applications of this material, it is an excellent candidate for optic mirrors used in an Airbone Laser (ABL) device. However, the low fracture toughness and extreme brittleness characteristics of SiC are predominant factors for its poor machinability. This paper presents surface grinding of SiC using diamond cup wheels to assess the performance of diamond grits with respect to the roughness produced on the machined surfaces and also the morphology of the ground work-piece. Resin bonded diamond cup wheels of grit sizes 46 µm, 76 µm and 107 µm; depth of cut of 10 µm, 20 µm and 30 µm; and feed rate of 2 mm/min, 12 mm/min and 22 mm/min were used during this machining investigation. It has been observed that the 76 grit performs better in terms of low surface roughness value and morphology.
Highlights
Silicon carbide (SiC) material had long been introduced in into the precision manufacturing industries in the mid1990s due to its potential industrial applications the material has been around since 1891
Despite the salient properties of this SiC material, it is noted for its low fracture toughness and extreme brittleness which result into its poor machinability
This paper presents surface grinding of silicon carbide using diamond cup wheels to assess the performance of diamond grits with respect to the surface roughness generated on the machined surface and the morphology ground work-piece
Summary
Silicon carbide (SiC) material had long been introduced in into the precision manufacturing industries in the mid1990s due to its potential industrial applications the material has been around since 1891. According to Ravindra, et al [1], SiC being one of the advanced engineered ceramics, was designed to operate in extreme environments. It had been revealed by [2, 3] that SiC had been employed as a coating and structural material due to its unique properties which are not limited to the larger energy bandgap and breakdown field allowing of the material to be used in high temperature, high-power and radiation-hard environments, its mechanical stiffness expressed by high Young’s modulus and the material’s tribology properties such as wear resistance and self-lubricating. Despite the salient properties of this SiC material, it is noted for its low fracture toughness and extreme brittleness which result into its poor machinability
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