Precision assembly of a miniaturized wire deflector for electron-beam lithography

Abstract

The fast and precise deflection of electron-beams is mandatory for common electron beam tools and next generation multi-beam lithography systems. Electrostatic fields generated by an arrangement of electrodes with several electric potentials are used to control the electron beam. The miniaturization of such a beam-deflection system facilitates its integration at a favorable place within the electron-optical column. An efficient and accurate beam deflection with high sensitivity and low aberrations is consequently possible. The novel wire-based electrostatic deflector for electron-beam Lithography Tools presented in this paper strictly pursues this approach. Design investigations as well as manufacturing and alignment procedures are reported. 24 wire electrodes are arranged in a circular FEA-optimized pattern and kinematically well-defined mounted to a supporting structure using the Solderjet Bumping technique [2,3]. This flux free solder technique ensures vacuum compatible joints free of hydrocarbons and with an excellent long-term stability. A prototype of the wire deflector is measured by means of a high resolution X-ray computer tomography scanner (CT) [4]. The single wire elements of the wire deflector are symmetrically arranged to each other within an accuracy of a few microns.