Abstract
Placing nanowires at the predetermined locations on a substrate represents one of the significant hurdles to be tackled for realization of heterogeneous nanowire systems. Here, we demonstrate spatially-controlled assembly of a single nanowire at the photolithographically recessed region at the electrode gap with high integration yield (~90%). Two popular routes, such as protruding electrode tips and recessed wells, for spatially-controlled nanowire alignment, are compared to investigate long-range dielectrophoretic nanowire attraction and short-range nanowire-nanowire electrostatic interaction for determining the final alignment of attracted nanowires. Furthermore, the post-assembly process has been developed and tested to make a robust electrical contact to the assembled nanowires, which removes any misaligned ones and connects the nanowires to the underlying electrodes of circuit.
Highlights
Despite the abundance of functional nanowires and the demonstration of the elemental devices based on them, effective device fabrication remains unresolved
The method described in this paper offers a promising approach to position the single nanoscale building block at the predefined locations, made possible by the combination of the dielectrophoretic force from the photoresist wells and the electrostatic force from the polarized nanowires
It was demonstrated that the post-assembly process via the electrodeposition and dielectric layer removal can effectively transfer the assembled nanowires, only trapped in the photoresist wells, to the metal electrode, producing a large array of mechanically- and electrically-robust nanodevices
Summary
Despite the abundance of functional nanowires and the demonstration of the elemental devices based on them, effective device fabrication remains unresolved. Assembly of a single nanowire at a predefined position and orientation with submicron registration accuracy is desirable, and especially preferable is a process that facilitates post-metallization of both ends of the nanowires Some techniques, such as Langmuir-Blodgett film [1], fluidic directed-alignment [2], blown bubble film [3], chemically-functionalized patterns [4], and the contact printing method [5,6,7], have been proposed to integrate the nanowire on the substrate in a controlled fashion while keeping pace with the advances in nanowire synthesis and characterization. The post-assembly process to fabricate the individual nanoscale device array and its perspective associated with the nanowire assembly are discussed
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