Precipitation, Recrystallization, and Evolution of Annealing Twins in a Cu-Cr-Zr Alloy

Xiaobo Chen,Jingyu Jiang,Zhongqin Tang,Pian Xu,Feng Jiang,Mengmeng Tong

doi:10.3390/met8040227

Abstract

In this paper, the precipitation, recrystallization, and evolution of twins in Cu-Cr-Zr alloy strips were investigated. Tensile specimens were aged at three different temperatures for various times so as to bring the strips into every possible aging condition. The results show that the appropriate aging parameter for the 70% reduced cold-rolled alloy strips is 723 K for 240 min, with a tensile strength of 536 MPa and an electrical conductivity of 85.3% International Annealed Copper Standards (IACS) at the peak aged condition. The formation of fcc (face-centered cubic) ordered Cr-rich precipitates (β′) is an important factor influencing the significant improvement of properties near the peak aged condition. In terms of crystallographic orientation relationships, there are basically two types of β′ precipitates in the alloy. Beyond the Cr-rich precipitates (β′(I)) formed during the early aging stages, which mimic a cube-on-cube orientation relationship (OR) with the matrix, another Cr-rich precipitate (β′(II)) is observed in the peak aged condition. β′(II) is coherent with the matrix, with the following ORs: [111]β′(II)//[100]Cu, {02-2}β′(II)//{02-2}Cu and [011]β′(II)//[211]Cu, {200}β′(II)//{-111}Cu. These precipitates have a strong dislocation and grain boundary pinning effect, which hinder the dislocation movement and crystal boundary migration, and eventually delay recrystallization and enhance the recrystallization resistance of the peak aged strips. During the subsequent annealing process, the transition phase β′ gradually loses the coherence mismatch and grows into a larger equilibrium phase of chromium with a bcc (body-centered cubic) structure (β), resulting in the reduction of the pinning effect to dislocations and sub-grains, so that recrystallization occurs. Annealing twins are formed during the recrystallization process to release the deformation energy and to reduce the drive force for interface migration, eventually hindering grain growth.

Highlights

Copper and its alloys are widely used in automobile, electronic, and electric power industries due to their high strength, high thermal and electrical conductivity, and good ductility, as well as because they can be shaped [1,2,3,4,5,6]
It can be observed that tensile strength and electrical conductivity increase rapidly during the early stage of aging as the second phase particles rapidly form in the matrix
It can be observed that, when the aging temperature is increased to 773 K, the tensile strength in the peak aged condition is lower than that of aging at 723 K

Summary

Introduction

Copper and its alloys are widely used in automobile, electronic, and electric power industries due to their high strength, high thermal and electrical conductivity, and good ductility, as well as because they can be shaped [1,2,3,4,5,6]. To satisfy applications in the frame materials in large-scale integrity circuits, besides the requirement of high strength and high electrical conductivity, excellent recrystallization resistance is needed. Cold working and aging treatment are considered to be the two most. Fiber and banded structures can be formed during the cold work process, resulting in an increase of strength and hardness. The strength and electrical conductivity can be further improved via aging treatment through the formation of second phase precipitation. The main strengthening phase formed during the aging process is the equilibrium phase of chromium (β) with a body-centered cubic structure (bcc, a = 0.2895 nm). There is a general agreement about the fact that a transition phase β0 is formed during the ternary Cu-Cr-Zr alloy aging process [16,17].

Methods

Results

Discussion

Conclusion