Abstract
Today's telecommunications power supply modules need a circuit technology with superior electrical and thermal performance. Power supplies must also be low-profile, light-weight, board mountable at point of use, highly efficient, and reliable at a reduced cost. Thick film technology allowed hybrid circuit design with optimal performance in power dissipation and high frequency switching. By combining the superior performance of thick film with adequate design and component selection could be designed a circuit with optimal performance. Selection the basic configuration of device, specific layout design rules and selection appropriate components and thick film materials are described.
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