Power noise suppression technique using active decoupling capacitor for TSV 3D integration

Abstract

In three-dimensional (3D) integration, the increasing supply current through both package and through-silicon-via (TSV) would lead to a large simultaneous switching noise potentially. In this paper, a noise suppression technique using low power active decoupling capacitors (DECAPs) is proposed for TSV 3D integration. Through the latch-based noise detection circuitry, the power supply noise can be detected and regulated via active DECAPs. Based on UMC 65nm CMOS technology and TSV model at 1V supply voltage, the proposed noise suppression circuit can realize maximum 7.4dB supply noise reduction and 12X boost fact at the resonant frequency.