Abstract
In recent years, several new power module designs have emerged, principally driven by the severely challenging requirements for high power density and integration from the automotive industry. Indeed, electric and hybrid cars are the best example of technology innovation in the design of power modules. The Toyota Prius' fourth generation double-sided cooling power modules might be the most well-known example. Yet today many other module manufacturers are also proposing new designs that move away from conventional power module layers and technologies. In our presentation, we will start with market trends and illustrate how industrial applications still remain the biggest part of the power module market. We will then demonstrate that the automotive industry is leading in technological innovations in packaging, helping and accelerating the implementation of these new technologies thanks to high manufacturing volumes. We will detail these technology trends by providing real teardown and cost analysis of various power modules. We will explain how they are creating opportunities for some material suppliers, and at the same time, are transforming today's businesses for power packaging.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
