Abstract
This article aims to provide an update of the reliability aspects of research on power electronic components and hardware systems. It introduces the latest advances in the understanding of failure mechanisms, testing methods, accumulated damage modeling, and mission-profile-based reliability prediction. Component-level examples (e.g., Si IGBT modules, SiC MOSFETs, GaN devices, capacitors, and magnetic components) are used for illustration purposes in addition to system-level studies. The limitations and associated open questions are discussed to identify future research opportunities in power electronics reliability.
Highlights
E FFICIENCY and power density have been at the heart of the power electronics community over the course of the last five decades
In [4], the primary research activities in the power cycling tests of power modules between 1994 and 2015 are summarized, which shows the varieties in packaging technologies, control strategies, failure mechanisms
1) Short-circuit and overstress failure of SiC MOSFETs: The reliability performance of SiC MOSFETs is of significant consideration in power electronic applications
Summary
E FFICIENCY and power density have been at the heart of the power electronics community over the course of the last five decades. The business model in industry has been transitioning from product suppliers to holistic service providers This demands life-cycle-cost reduction and operation optimization of power electronic converters through innovative design, in-depth understanding of failure mechanisms and mission profiles, and predictive maintenance. In 2013-2014, the authors reviewed the three aspects of research in power electronics reliability in [1, 2]. In [4], the primary research activities in the power cycling tests of power modules between 1994 and 2015 are summarized, which shows the varieties in packaging technologies, control strategies, failure mechanisms. This paper starts with a description of the relevance of component-level failure mechanisms in power electronic applications.
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Journal of Emerging and Selected Topics in Power Electronics
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
