Abstract
In this work, the effect of deposition power on the structural, morphological, and electrical properties of e-beam evaporated tantalum films was investigated. The as-deposited tantalum films were characterized using x-ray diffraction (XRD), field emission scanning electron microscopy (FESEM), energy dispersive x-ray (EDX) and four-point probe resistivity measurements. The XRD patterns revealed the growth of a tetragonal crystalline structure (β-Ta), and the crystallinity of the films increased with increased deposition power. The FESEM images showed that the tantalum film morphology was smooth with fine spherical particles on the surface, and the grain size was found to increase with deposition power. The resistivity of the tantalum films decreased with increased deposition power.
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