Abstract
The load cycling capability of novel power semiconductors is an important aspect when estimating their lifetime in field service. The Power Cycling Test (PCT) is the standard test to evaluate the lifetime of a semiconductor device under thermo-mechanical stress. PCTs are typically performed at temperature swings (ΔT) much higher than common operating conditions, to obtain results within a reasonable time. In this work, the PCT capability of gallium nitride (GaN) and gallium oxide (Ga2O3) lateral transistors is investigated. The GaN devices were tested in two groups with different ΔT. The temperature of the devices was monitored using two different temperature sensitive electrical parameters (TSEPs) and the accuracy of both methods was evaluated by comparing the results with the temperature, monitored by using an infrared (IR) camera. For Ga2O3 devices, no data on potential TSEP exists so far, thus, the typical TSEP for silicon (Si), silicon carbide (SiC) and GaN were investigated for their applicability to Ga2O3 devices. While a PCT was conducted on the devices, the temperature was also monitored using an IR camera. The results of the comparison of TSEP and IR camera data showed, that the accuracy of the TSEP for GaN matched either the temperature of the hottest spot on the chip (VDS method), or the average chip temperature (VGS method). For the Ga2O3 devices no suitable TSEP could be obtained and only the IR camera was used for the temperature measurement. It revealed a very uneven temperature and thus, current distribution on the chip. Furthermore, both GaN and Ga2O3 devices exhibit an outstanding power cycling capability with no failure after completing several millions of cycles. Considering the difference in Young’s Modulus of Si, GaN and Ga2O3, the PCT performance of GaN on silicon devices and Ga2O3 devices should be inferior to silicon devices. Thus, both device types, the GaN transistors and the Ga2O3 transistors, showed a PCT capability much higher than expected.
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