Abstract

Interaction of modified polyimide films with agrentium nitrate solutions of various concentrations was studied. Sorption of Ag ions by films is divided into three steps: formation of Ag ion layer on the border of film surface; diffusion inside the films; and final saturation of film by Ag ions. The data are confirmed by calculation of weight of the sorbed Ag ions onto the films with various thicknesses. Electrochemical Ag loading of PI films includes two parallel reactions: film dissolution accompanied by chelation.

Highlights

  • The metallization of plastic, in particular of polyimide films, is included into the number of perspective directions of the modern technology

  • Absorption kinetics of Ag cations into a modified surface layer of PI films has been studied between 10-4-10-2 M concentration range under potentiometric control of silver ion concentration

  • Sorption of Ag ions from the solution occurs due to chemical interactions Ag cations with a surface layer of the modified film

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Summary

Introduction

The metallization of plastic, in particular of polyimide films, is included into the number of perspective directions of the modern technology. With metal loading, find wide application in airspace, electronics and other perspective areas of engineering In this regard, among the various polymeric materials the interest is focused on polyimides (PI), which have high thermal and radiation resistance and excellent physicomechanical properties [1,2]. The present investigation is to study the first stage of plating process of such modified films - interaction of the modified polyimide film with solutions of silver nitrate. Absorption kinetics of Ag cations into a modified surface layer of PI films has been studied between 10-4-10-2 M concentration range under potentiometric control of silver ion concentration. Sorption of Ag ions from the solution occurs due to chemical interactions Ag cations with a surface layer of the modified film.

Potentiometric Control of Metal Concentration
RT nF
Results and Discussion
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