Abstract

Electrochemical oxidation of copper in aqueous phosphate buffer solution leads to the formation of passive films, which breakdown in the presence of aggressive chloride (Cl−) ions. The addition of Cl− ions in the medium causes shift in current and potential for both cathodic and anodic peaks. At low Cl− ion concentrations, the corrosion current is greatly enhanced and continues to increase up to a certain concentration, after which it decreases. The effect of inorganic ions, chromate (CrO42−) and tungstate (WO42−), and organic ions, acetate (CH3COO−) and oxalate (C2O42−), on the formation and breakdown of passive films in aqueous buffer solution containing 0.10 M Cl− ions have also been investigated. All of the ions inhibit corrosion of copper in the presence of aggressive Cl− ions following the order of overall inhibition efficiency of CrO42− > C2O42− > WO42− > CH3COO− under the experimental conditions.

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