Abstract
Thermal properties of thermally conductive epoxy based composites are mainly influenced by their formulation and thermal processing. The present study is intended to develop an effective thermally conductive filler filled epoxy composite as thermal interface material (TIM) for light emitting diode (LED) application. Two different average particle sizes of aluminium oxide (Al2O3) powder (44 and 10 µm) were studied for its feasibility as filler material at its maximum loading. For given filler loading of 75 wt%, larger; 44 µm Al2O3 particle filled composite resulted in enhanced thermal conductivity of 2.06 W/mK. 10 µm Al2O3 composites achieved maximum thermal conductivity of 1.19 W/mK. Computational fluid dynamics software was utilized in order to investigate the thermal performance of the LED with the fabricated TIMs. The analyses were carried out using FloEFD 15 to predict the junction temperature (TJ) at the active region of the LED under test. The simulation predictions were validated with experimental results employing thermal transient measurement. The least TJ was achieved for 10 µm Al2O3 filled TIM followed by 44 µm and then neat epoxy with the average values of 66.30, 86.16 and 92.03 °C respectively.
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