Abstract
The BPN is a negative photoresist, sensitive in the UV at 365 nm and was previously dedicated for Wafer Level Packaging applications. This photoresist offers the advantage of forming thick layers; however, it suffers from low aspect ratio (2:1 declared by the supplier). This work reports the BPN's technological process that allows forming 200---800 μm thick molds for electroplating purposes. Our results revealed an aspect ratio as high as 17:1 while having vertical sidewalls using conventional photolithography.
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