Abstract
In this paper, we report the potential benefits of dopingless double-gate field-effect transistor (DL-DGFET) designed on ultrathin silicon on insulator film for low power applications. The simulation results show that the proposed device exhibits higher ON current and less sensitivity toward device parameter variation compared with highly doped junctionless (JL) DGFET. The constraints of high metal gate workfunction of JL device are also relaxed using midgap materials as a gate electrode in the DL-DGFETs. Sensitivity analysis shows that the DL-DGFET exhibits least sensitivity to device parameter variation especially gate length due to suppression of short-channel effects. The DL-DGFET also shows lower static power dissipation in OFF state and lower intrinsic delay in ON state. The mixed-mode simulation of 6T-static random access memory cell using DL-DGFET shows impressive read and hold noise margins of 147 and 352 mV at V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DD</sub> = 0.8 V for ultralow power applications. The possible fabrication process flow of DL-DGFET is also proposed.
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