Abstract
Abstract— The performance and manufacturability of reflective displays can be enhanced by planarization, post‐processing, and integrated assembly. Simplified methods for planarization and assembly of liquid‐crystal‐on‐silicon (LCOS) microdisplays using polymeric resins are presented. Spin‐cast benzocyclobutene (BCB) resin shows a six‐fold reduction in step height on the surface of a typical LCOS backplane, at a cost significantly less than chemical mechanical polishing. Methods for dry‐etching low‐resistance contacts to the underlying circuitry and depositing high‐reflectivity mirrors have been developed. In addition, photo‐definable BCB resin has been utilized as both a spacer and adhesive technology in miniature‐display assembly. Cell‐gap thicknesses of 0.9–2.4 μm with 50–100‐nm cell‐gap variation and bonding shear strengths of 3200 ± 460 psi have been demonstrated, leading to wafer‐scale assembly of LCOS cells. The photo‐BCB spacer and adhesive technology is compatible with common liquid‐crystal‐alignment techniques. In this paper, the methods and results of LCOS backplane planarization, post‐processing, and integrated display assembly are described.
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