Abstract
The possibility of solder-spreading transitions in solidification of solder at a rough rigid intermetallic surface is proven theoretically. Depending on the misorientation of scallops on the interface, one can observe a two-dimensional spreading transition over the scallops or a one-dimensional spreading transition along the triple-junction of two intermetallic compound scallops and liquid solder. The extent of undercooling can be determined not only by different interface energies, but by different angles between neighbouring scallops as well.
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