Year-end Sale % OFF 
Abstract
We found positive pattern formation by ionic bonded photo-sensitive polyimide (PSPI). The PSPI is composed of poly(amic acid), photo-reactive tertiary amine (such as N.N-dimethylaminoethylacrylate), and photo-initiator. The PSPI basically has negative photo-sensitivity. However, we found that positive pattern formation from the PSPI when adding a post-exposure bake (PEB) about 120-140 °C. By adding PEB, imidization rate of unexposure area of PSPI is higher than that of exposed area. High imidizaiton of unexposed area of PSPI makes hard to solubule to alkaline solution. The imidization rate difference attributes to glass transition temperature difference between exposed area and unexposed area.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
