Positioning accuracy control of dual-axis dicing saw for machining semiconductor chip

Abstract

Dicing of semiconductor chips constitutes an important procedure in the processing of integrated circuits, which poses a high-precision and high-speed stability requirements for dicing saw. In this study, the optimization of motion accuracy and position accuracy of dual-axis dicing saw (DDS) is studied and an overall control scheme of the DDS is designed. A programmable multi-axis controller (PMAC) is selected as the main control module and the servo motor is adopted as the linear axis drive element. The positioning algorithm of servo control system is analyzed. The position deviations are studied under different proportional gains, integral time constants, and speed feedforward gains. The high-precision contact and non-contact positioning method of the machine tool is developed. Positioning error of each linear axis is compensated using positioning error compensation module of PMAC. The dicing test results demonstrate that the improved control system could be used for high-precision and high-speed stability dicing of semiconductor chips.