Abstract

In this paper, we investigated the position-dependent stress distribution of indium–tin–oxide (ITO) film on a polycarbonate (PC) substrate by applying an external bending force. It was found that crack density is maximum at the center position and decreases toward the edge. In accordance with crack distribution, it was observed that the change is electrical resistivity of ITO islands is maximum at the center and decreases toward the edge. From the result that crack density increases at the same island position as face-plate distance (L) decreases, it is evident that more stress is imposed on the same island position as L decreases.

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