Portable communications: trends in systems and component technology

Abstract

Journal of Electronics ManufacturingVol. 04, No. 04, pp. 203-209 (1994) PAPERSNo AccessPortable communications: trends in systems and component technologyDENIS GROSSDENIS GROSSBPA (Technology & Management) Ltd, Dorking, Surrey RH4 1QT, UK Search for more papers by this author https://doi.org/10.1142/S0960313194000213Cited by:4 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractImmense progress in mobile communications technology has made wireless, mobile and personal communications one of the fastest-growing markets worldwide. The new wireless age centres on ‘globalization and personalization’, and employs technologies like cellular telephones, radio pagers, digital cordless telephones and mobile data systems in the integration of voice, data, image and communications. Developments are very rapid across all mobile communications sectors, especially as digital technology has been successfully introduced into all major categories. While cellular markets will remain dominated by analogue systems well into the middle of the decade, digital technology, high frequencies, small, light and low-cost handheld units are the major driving factor behind the forthcoming communications boom. Digital cellular telephones, for example, involve high frequencies (1.8 GHz), built-in high-performance computing power (30–40 MIPs), and can be built in 12 minutes, compared to the 8 hours it took in the late 1980s. Within this dramatic growth market, there are clearly significant opportunities for the manufacturers of the equipment, for the network and service providers, and also for the electronic components materials, interconnection, packaging and assembly industries.Keywords:Mobile communicationswireless communicationscellular telephonescordless telephonesdigital cellular telephonypersonal communication systems FiguresReferencesRelatedDetailsCited By 4A new under bump metallurgy for solder bump flip chip applicationsKari Kulojärvi and Jorma Kivilahti1 Aug 1998 | Microelectronics International, Vol. 15, No. 2A low temperature interconnection method for electronics assemblyK. Kulojarvi and J.K. Kivilahti1 Jun 1998 | IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, Vol. 21, No. 2Effects of chip scale package and flip‐chip on the design and manufacturing of electronic productsPetri Savolainen1 Apr 1998 | Microelectronics International, Vol. 15, No. 1A low temperature interconnection method for electronics assemblyK. Kulojarvi and J.K. Kivilahti Recommended Vol. 04, No. 04 Metrics History KeywordsMobile communicationswireless communicationscellular telephonescordless telephonesdigital cellular telephonypersonal communication systemsPDF download