Abstract
This chapter discusses the use of porous silicon as a sacrificial supporting layer during silicon diaphragm formation by precision grinding. Unsupported silicon diaphragms formed by grinding exhibit post-grinding shape distortion dependent upon diaphragm thickness and diameter. Such distortion can be eliminated or strongly suppressed by use of a support during the grinding process. Use of porous silicon as in-situ support for 15 – 150 μm thick diaphragms is explained with emphasis on porous silicon properties, diaphragm thickness and fabrication processing steps such as oxidation.
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