Pool Boiling Performance of Multilayer Micromeshes for Commercial High-Power Cooling.

Kairui Tang,Yalong Sun,Jingjing Bai,Shiwei Zhang,Jie Li,Siyu Chen,Gong Chen

doi:10.3390/mi12080980

Abstract

With the rapid development of electronics, thermal management has become one of the most crucial issues. Intense research has focused on surface modifications used to enhance heat transfer. In this study, multilayer copper micromeshes (MCMs) are developed for commercial compact electronic cooling. Boiling heat transfer performance, including critical heat flux (CHF), heat transfer coefficients (HTCs), and the onset of nucleate boiling (ONB), are investigated. The effect of micromesh layers on the boiling performance is studied, and the bubbling characteristics are analyzed. In the study, MCM-5 shows the highest critical heat flux (CHF) of 207.5 W/cm2 and an HTC of 16.5 W(cm2·K) because of its abundant micropores serving as nucleate sites, and outstanding capillary wicking capability. In addition, MCMs are compared with other surface structures in the literature and perform with high competitiveness and potential in commercial applications for high-power cooling.

Highlights

Intelligent Manufacturing Engineering Laboratory of Functional Structure and Device in Guangdong, School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640, China; Citation: Tang, K.; Bai, J.; Chen, S.; Abstract: With the rapid development of electronics, thermal management has become one of the most crucial issues
When the heat flux continually increases to the critical heat flux (CHF), exceeding the highest heat transfer capacity the sample can dissipate, giant bubbles will cover the entire surface of the sample and prevent the phase-change heat transfer process, which results in a violent temperature rise as the heat transfer efficiency sharply deteriorates
In the nucleation stage, those high-density microcavities enable the formation of nucleation sites and provide more liquid flow channels, which may further delay the CHF and increase the heat transfer coefficients (HTCs)

Summary

Introduction

Intelligent Manufacturing Engineering Laboratory of Functional Structure and Device in Guangdong, School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640, China; Citation: Tang, K.; Bai, J.; Chen, S.; Abstract: With the rapid development of electronics, thermal management has become one of the most crucial issues. Boiling heat transfer performance, including critical heat flux (CHF), heat transfer coefficients (HTCs), and the onset of nucleate boiling (ONB), are investigated. With the rapid development of microelectronic technology, the dimensions of hightech electric devices are becoming more and more miniaturized and integrated [1,2,3,4] This trend creates huge challenges for efficient heat dissipation in such narrow spaces. Pool boiling is an efficient and promising method to meet this cooling requirement because of its advantages in high heat dissipation capability, uniform surface temperature, and low energy consumption. Key factors, including the heat transfer coefficient (HTC), critical heat flux (CHF), and the onset of nucleate boiling (ONB), are usually utilized to evaluate the pool boiling performance of the surface structures. To obtain a highly efficient boiling heat transfer, the ultimate goal is to increase the HTC and CHF and decrease the ONB of the structures

Objectives

Methods

Results

Conclusion