Abstract
The paper describes experimental study results for three kinds of enhanced surfaces (smooth surface, plain minifin surface and minifin surface with sintered perforated foil) and for two kinds of boiling fluids (ethyl alcohol and Novec TM 649). Novec 649 is considered to be an environmentally friendly alternative for electronic devices cooling applications. The experiments were carried out at atmospheric pressure. Compared with smooth surface, the surface with plain minifins provides approximately 1.5-times higher heat transfer coefficient obtained with Novec TM 649 and ethyl alcohol boiling. At low and medium heat fluxes minifins with porous covering produced the highest heat transfer coefficient.
Highlights
Cooling high power density devices poses a continuous challenge to thermal engineers
For NovecTM 649, boiling incipience occurred at a temperature lower than that for ethyl alcohol
Hysteresis was observed in both boiling fluids for minifins-porous surface covering with pores 0.05 mm in diameter (MFP-1.0-0.6-0.05)
Summary
Cooling high power density devices poses a continuous challenge to thermal engineers. For electronic equipment to achieve its full performance, appropriate thermal management is critical. The review of the boiling-related literature presented by Pastuszko [1] focuses on selected experimental studies dealing with pool boiling heat transfer on five different surface types, these being tunnels covered with perforated foil or a wire mesh, tunnel-pore integral surfaces, extended surfaces with mini- and microfins, microchannels, narrow channels/confined space. Most papers offer individual results obtained for a narrow range of parameter changes. In the most recent works, researchers report a return to using water as a working fluid on micro- and nanofins (fibres), in structural tunnels and open channels. On nano- and microsurfaces, dielectric fluids (FC-72, FC-3284, HT-55) and refrigerants (R-134a, R-123) are commonly used
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