Pool boiling heat transfer enhancement on the hybrid surfaces coupling capillary wick and minichannels

Abstract

Pool boiling heat transfer can fully utilize the latent heat of the vaporization, to meet the heat dissipation needs of high-power electronic components. In this study, several enhanced hybrid surfaces were designed and processed by sintering spherical copper powder on the minichannels in different ways. The coupled effects of various parameters of capillary wick and minichannels were considered to enhance the pool boiling heat transfer performance of these hybrid surfaces using HFE-7100 as the working fluid. The bubble dynamic behaviors were captured and analyzed by the high-speed camera. The results indicate that the ring groove around the minichannels and the capillary wick have a significant impact on the boiling heat transfer of these hybrid surfaces. This is because the capillary wick provide a large number of nucleation sites and large specific surface area, which can greatly reduce the contact thermal resistance between the capillary wick and the minichannels. At ΔTsub = 30 K, the critical heat flux (CHF) of hybrid surfaces coupling capillary wick and minichannels is up to 147.4 W/cm2, and its maximum heat transfer coefficient (HTC) is 2.69 W/(cm2·K). Compared with minichannels without capillary wick covered, the CHF and HTC are increase by 86.8% and 192.0%, respectively. Furthermore, a correlation for predicting CHF on these hybrid surfaces covered capillary-wick is proposed. Dimensionless parameters such as the subcooled Jakob coefficient (Jasub), the outer surface area enhancement ratio (AER), the particle distribution coefficient (PDC) and the ratio of inner to outer surface area of capillary wick (IOR) are defined to estimate the effect of different factors on the CHF.