Polysiloxane based flexible electrical–optical-circuits-board

Abstract

In the paper, a packaging technique of polysiloxane based flexible electrical–optical-circuits-board (EOCB) with Kapton (Dupont) foils was developed and introduced. The main mechanism of forming a good bonding between polysiloxane and Kapton foil was identified and verified. The optical and mechanical properties of the polysiloxane waveguide layer remained unchanged before and after packaging. According to the defined procedures, the environmental stability of packaged EOCBs has been tested with the result that they exhibited excellent mechanical, optical, and thermal stabilities. The mechanical stability limit of the tested EOCBs is determined only by the intrinsic mechanical stability of the used polysiloxane materials. The optical waveguide propagation loss at 850 nm is less than 0.1 dB/cm after surviving from the defined environmental test procedures.