Abstract
A super-engineering-plastic polyphenylene sulfide (PPS)-based composite was fabricated for circuit board application. A small amount of liquid crystal polymer (LCP) was blended with PPS in order to enhance the copper plating performance. In addition, 8 wt% of laser activated particles (LAPs) were added to the polymer blend. LCP/LAP exhibited a better interfacial affinity than that of PPS/LAP. A weakly layered structure was observed for the PPS–LCP blend due to flowability difference of two polymers; LCP was flow to surface during injection molding. These layered structure and interfacial affinity difference led the LAP leaning, a small number of LAPs were observed at the PPS dominant region, while a larger amount was observed at the LCP dominant region. Moreover, the mechanical property, circuit building speed and adhesion of copper circuit also improved after the LCP blend. Therefore, laser direct structuring and electroless plating applicable PPS composite was fabricated vis LCP blend.
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