Abstract
Carbon nanotubes (CNTs) have physical properties that significantly exceed those of commonly used fillers and additives. With a tensile strength eighth times greater than stainless steel and with a thermal conductivity five times greater than copper, CNTs are obvious choices for creating a new class of composite materials. Their inclusion in polymers, such as epoxy, holds the potential to boost the host materials electrical, mechanical and thermal values by orders of magnitude well above the performance possible with traditional fillers such as carbon black or ultra fine metal powders. The paper presents polymer/CNTs composite for electronic packaging applications. Different types of epoxy serve as insulator matrices whereas different types of carbons: carbon nanotubes CNTs (single walled SWNTs, multiwalled MWNTs) or composites based on CNTs have been used as active phase. For characterization of obtained polymeric composites have been used physicochemical investigations, electrical measurements (dependence of electrical properties on type and content of conductive filler, curing method and curing temperature) and stability tests
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