Abstract
Tremendous effort is put into enhancing reliability of Ball grid array (BGA) solder joints. The BGAs are utilized as interconnection method in the electronic packaging industry due to its vast advancement in circuit miniaturization. New materials are introduced to further improve the reliability of the BGA solder joint. In this study, the stress response of BGA solder ball during vertical loading is scrutinized through simulation. The Micropearl BGA solder joint and normal BGA solder joint were utilized in this study for stress response comparison purpose. Both BGA models were subjected to vertical loading forces of 1N, 3N and 5N respectively. Ansys version 11 was employed for the simulation process. The normal BGA solder joint exhibited higher stress response when compared with the Micropearl BGA solder joint at all vertical loading force due to differences in the core structure.
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