Abstract
In this paper, a novel polymer circuit board fabricated by ultrasonic hot embossing is presented. Conductive paths are generated by ultrasonically embossing interruptions into a continuous metal layer coated onto a plastic substrate, and all electronic components are mounted onto the board in a single ultrasonic process step. With this process both the fabrication of a board and the interconnection of electronic components can be achieved in seconds. Overall dimensions of the board are determined by the size of the sonotrode of the ultrasonic machine. As a demonstrator a multivibrator circuit was built up from five resistors, two LEDs, two transistors and two capacitors. The multivibrator was tested successfully.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
