Abstract
This paper deals with the effect of the silicon bonding temperature with thermoplastic adhesive. The bonding temperature exhibits a significant effect on the morphology and on the adherence energy of the bonded stack. A suitable temperature control leads to an excellent homogeneity of the bonded structure and an optimal total thickness variation (TTV) value. Using Brewer Bsi5150 adhesive material, 275 °C appears as the optimal bonding temperature in order to optimize the TTV from 55 µm down to 5 µm. The adherence of the structure is also increased with high bonding temperatures. Indeed, the adherence energy is above 10 J/m2 when the temperature is above 250 °C. On the contrary, when the temperature is less than 150 °C, the adherence is only around 1 J/m2. Noteworthy, this value is suitable for back side processing and a mechanical debonding of the structure without any need of other specific layer which could lead to a very simple temporary bonding process.
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