Abstract
Printed wiring boards (PWBs) with high wiring density such as thin multilayer PWBs and flexible PWBs requiring bonding sheets with superior thermal and adhesive properties, and must have a flat board surface. To meet these requirements, a polymer alloy adhesive film made up of epoxy resins and aromatic polyester has been developed. The crosslinking reaction between the components was utilized to improve thermal properties. The polymer alloy adhesive film demonstrates good heat resistance and adhesiveness. It features a low processing pressure of 2 MPa at 170°C and gives the board surface greater flatness, which is better for the fine wiring of PWBs.
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