Poly(L-lactic acid)/graphene composite films with asymmetric sandwich structure for thermal management and electromagnetic interference shielding

Abstract

The blowout growth of the power density and transmission efficiency of microelectronic devices makes the problems of “overheating” and electromagnetic pollution of electronic devices increasingly prominent, and it is raising an urgent demand to improve the thermal conductivity and electromagnetic interference (EMI) shielding performance of packaging materials. Additionally, the environmental damage caused by fossil-based electronic waste should not be ignored. Hence, a scalable production strategy was proposed to prepare sandwich structure poly(L-lactic acid) (PLLA) composite films with high thermal conductivity and excellent EMI shielding efficiency (SE), which was achieved via solution pouring method and stacking hot-pressing process, in which PLLA/graphene nanoplatelets (PLLA/GNPs) with different GNPs contents was the top and substrate layers, and PLLA/poly(D-lactic acid)/Fe3O4 (PLLA/PDLA/Fe3O4) with a small amount of PDLA and Fe3O4 was the middle layer. Owing to the asymmetric distribution of filler and the successful introduction of magnetic particles, when the GNPs and Fe3O4 contents of the whole film are respectively only 5.61 wt% and 4.39 wt%, and the asymmetric ratio is 1:9, the in-plane thermal conductivity (K‖) and EMI SE of the composite film reaches 7.49 W m−1 K−1 and 41.7 dB, respectively, higher than those of PLLA film with symmetric structure (3.31 W m−1 K−1 and 33.0 dB) at the same contents of fillers. Furthermore, a small amount of PDLA (4.39 wt%) promotes the formation of stereocomplex (SC) crystallites in the middle layer and further induces the interlayer SC microcrystals during the stacking hot-pressing process, enhancing the interlayer interaction to maintain the mechanical robustness of the PLLA film. This work provides a new direction for the manufacture of polymer based composite films with high thermal conductivity and directional EMI shielding, and has broad application potential in the field of large-scale production of green electronic products.