Abstract
The atmospheric pressure He- H 2 O plasma jet has been analyzed and its effects on the Kapton polyimide surface have been investigated in terms of discharge power effect. The polyimide surfaces before and after plasma treatment were characterized using atomic force microscopy (AFM), X-ray photoelectrons spectroscopy (XPS) and contact angle. The results showed that, increasing the discharge power induces remarkable changes on the emission intensity, rotational and vibrational temperatures of He- H 2 O plasma jet. At the low discharge power ≤5.2 W, the contact angle analysis of the polyimide surface remarkably decrease owing to the abundant hydrophilic polar C=O and N–C=O groups as well as increase of surface roughness. Yet, plasma treatment at high discharge power ≥5.2 W results in a slight decrease of the surface wettability together with a reduction in the surface roughness and polar groups concentrations.
Highlights
Nowadays, flexible electronics, such as wearable health monitoring devices, flexible solar cells, medical implants, and flexible displays, have great interest over the conventional silicon-based semiconductor technology as it is conform to curved surfaces and is stretchable [1,2].The widespread applications of flexible electronics has resulted in active research in the polymer-based electronics [3,4,5,6]
A typical example of the total power-total current waveforms of the He-H2 O plasma mixture is presented in Figure 2a, in which the mixture total flow rate was set at 10 L/min
An atmospheric pressure plasma jet generated in He+H2 O mixtures has been investigated as well as their effects on polyimide surface
Summary
Flexible electronics, such as wearable health monitoring devices, flexible solar cells, medical implants, and flexible displays, have great interest over the conventional silicon-based semiconductor technology as it is conform to curved surfaces and is stretchable [1,2].The widespread applications of flexible electronics has resulted in active research in the polymer-based electronics [3,4,5,6]. Flexible electronics, such as wearable health monitoring devices, flexible solar cells, medical implants, and flexible displays, have great interest over the conventional silicon-based semiconductor technology as it is conform to curved surfaces and is stretchable [1,2]. Polyimide is considered to be a promising flexible substrate due to its excellent optical, mechanical, thermal stability and low dielectric constant properties [7,8]. It is seldom used in its pristine form, as pristine polyimide surface is usually inert and partially hydrophobic. The inherited polyimide surface characters lead to poor wettability and/or a weak inter-facial interaction between polyimide (as flexible substrate) and the metal/semiconductor pattern. That is why surface modification of the polyimide is an important process which enables full usage of the relatively excellent polyimide’s bulk properties [9]
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