Abstract
ABSTRACTFree-standing polyimide film is used extensively in tape automated bonding (TAB) and flexible printed circuit (Flex) applications because of its excellent chemical, mechanical, and electrical properties. Kapton polyimide film has been the material of choice for many years. Recently, a new polyimide film, Upilex, has been introduced into the marketplace. The primary property differences between Kapton and Upilex result from differences in the chemical composition of each film. A review of property/product performance indicates that Upilex S is preferred with respect to dimensional stability, metal/polyimide and adhesive/polyimide adhesion, chemical inertness and glass transition temperature.
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