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Abstract
A new low temperature ceramic material for 3D printing based on polyaluminosilicate has been synthesized. Some of the synthesis stages are controlled by the parameters set for 3D aerosol printing. The processes of 3D aerosol printing of polyaluminosilicates filled with a highly dispersed filler have been studied. An optimal method for aerosol generation has been chosen that does not affect the supramolecular structure of a polyaluminosilicate binder. Ceramic dielectric topologies with high thermal conductivity and layer thickness in the nanometer range have been obtained by means of 3D aerosol printing of the synthesized material for the first time.
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