Abstract
Bi-layer resist processes for deep-UV and oxygen plasma are studied. Poly(dimethyl-co-diphenylsilane) is used as both deep-UV and oxygen plasma portable conformable masks because of its strong deep-UV and i-line (365 nm) absorption and its resistance to oxygen plasma. The bottom layer is P(MMA—PhPK), a copolymer of methylmethacrylate and 30 wt% of phenylpropenylketone, for the positive-tone pattern. P(MMA—PhPK) has greater deep-UV exposure sensitivity compared to PMMA. Good vertical sidewall profiles of lines of bottom layers are obtained.
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