Abstract
AbstractA systematic study of the voltammetric behavior of Cu(II) in the presence of polyacrylic acid (PAA) was carried out by means of sampled direct current polarography (DCP), normal pulse polarography (NPP), differential pulse polarography (DPP), reverse pulse polarography (RPP), cyclic voltammetry (CV), and differential pulse anodic stripping voltammetry (DPASV). Background currents due to PAA, and probably anodic oxidation of the Hg in this potential region, hinder the study of the Cu(II) reduction. Results obtained seem to indicate the lability of the Cu/PAA complex. Distorted DPASV signals are obtained for Cu(II) in the presence of PAA, which are explained on the basis of the change of the ligand‐to‐metal ratio during the different steps of the electrodic process. Titrations of Cu(II) with partially neutralized PAA allow the determination of the apparent formation constant K of the Cu/PAA complex system.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
