Abstract

The strain-induced splitting of the heavy-hole (hh) and light-hole (lh) valence bands for 4-\ensuremath{\mu}m-thick GaAs/Si is examined on a microscopic scale using linear polarized-cathodoluminescence imaging and spectroscopy. The energies and intensities of the hh- and lh-exciton luminescence are quantitatively analyzed to determine spatial variations in the stress tensor. The results indicate that regions near and far from the microcracks are primarily subject to uniaxial and biaxial tensile stresses, respectively. The transition region where biaxial stress gradually converts to uniaxial stress is analyzed, and reveals a mixing of lh and hh characters in the strain-split bands.

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