Abstract

Micro assembly is typically characterized by positioning tolerances below a few micrometers. In the case of the assembly of hybrid micro systems, such as optical systems, micro ball lenses or micro probes for measurement tasks, even positioning accuracies in the sub-micrometer range have to be achieved. The efficiency of the use of automated handling devices is strongly influenced by the flexibility of the equipment and the required application specific customizations. In this context a high precision assembly head is presented. It upgrades conventional robots with the ability to do fine alignment steps in sub-micrometer resolution and 6 DOF. Therefore it is equipped with a universal endeffector structure.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.