Abstract
The present study utilizes an acrylic (PMMA) plate with circular piezoelectric ceramics (PC) as an actuator to design and investigate five different types of piezo actuation jets (PAJs) with operating conditions. The results show that the heat transfer coefficient of a device of PAJ is 200% greater than that of a traditional rotary fan when PAJ is placed at the proper distance of 10 to 20 mm from the heat source, avoiding the suck back of surrounding fluids. The cooling effect of these five PAJs was calculated by employing the thermal analysis method and the convection thermal resistance of the optimal PAJ can be reduced by about 36%, while the voltage frequency, wind speed, and noise were all positively correlated. When the supplied piezoelectric frequency is 300 Hz, the decibel level of the noise is similar to that of a commercial rotary fan. The piezoelectric sheets had one of two diameters of 31 mm or 41 mm depending on the size of the tested PAJs. The power consumption of a single PAJ was less than 10% of that of a rotary fan. Among the five types of PAJ, the optimal one has the characteristics that the diameter of the piezoelectric sheet is 41 mm, the piezoelectric spacing is 2 mm, and the length of the opening is 4 mm. Furthermore, the optimal operating conditions are a voltage frequency of 300 Hz and a placement distance of 20 mm in the present study.
Highlights
Accepted: 2 August 2021With the advances in integrated circuit packaging technology and the miniaturization process, the density of the circuit packages embedded in electronic components and the speed of such circuits have improved
The result was a piezoelectric fan that could be compared with other small fans in terms of their effectiveness when used for heat dissipation in electronic products
The results showed that conquering damping can occupy over 50% of the total power input to a piezoelectric fan and exploit it for heat transfer purposes
Summary
With the advances in integrated circuit packaging technology and the miniaturization process, the density of the circuit packages embedded in electronic components and the speed of such circuits have improved. Kercher et al [22] used synthetic jet technology to manage the heat dissipation of electronic components Their experimental findings indicated that a piezoelectric synthetic jet had two times better cooling efficiency than the fans presently used as cooling technology. Many research studies have focused on the aerodynamic performance of oscillating piezoelectric fans with flexible beams composed of polymeric materials because of their potential as active cooling mechanisms for thermal management applications. The polymeric material of PMMA in the present paper is manufactured through a thermoplastic injection molding and rapid-uniform heating and cooling cycle system associated with a vapor chamber technology, which can improve the tensile strength and decrease the deficiency of the welding lines of a plastic product [34,35]. Tsai et al [36] exhibited that the plastic products with two opposite gates were found to enhance by 6.8 ◦ C and 10 ◦ C of tensile strength compared with the traditional one, and the other plastic product with eight holes plate is reduced from 12 μm to 0.5 μm of the depth of the welding line
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