PMC Effect Study on Package Delamination with Different EMC type

Abstract

Delamination is a key factor for semiconductor device integrity. Less delamination will help reduce risk of Cu wire corrosion, current leakage failure due to moisture absorption, and other package reliability issues. In this paper, two different Epoxy Molding Compound (EMC) applied with Post Molding Curing (PMC) process were studied, and delamination performance were collected by C-Scan after molding, after PMC and after Sn plating process.Study result shows different EMCs have different responses to PMC on delamination performance. Process conducted with EMC type A shows delamination reduction after plating, while the EMC type B shows no delamination reduction. EMC properties were characterized through Dynamic thermomechanical analysis (DMA), Thermal Mechanical Analyzer (TMA) and adhesion strength test, which helps explain different delamination relationship to PMC effect.This paper give insight on PMC process strategy to achieve minimum package delamination, different EMC need different PMC conditions. And involves discussion on thermal, mechanical and viscoelastic relaxation effects during PMC, these combined effects make different response to package delamination with different EMC.