Abstract
A new sputtering technique (PLISD: Pulse-Laser Induced Sputtering Deposition) for thin film deposition is reported. Instead of the glow discharges of usual sputtering processes, PLISD uses a pulsed laser and an electrically conductive target for the generation of the bombarding ions. Its features and possible advantages are indicated, among which is the possibility to carry out sputtering deposition in a high-vacuum environment. Some preliminary experimental results are given which demonstrate the feasibility of the PLISD technique.
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