Plenary sessions overview: SiC power devices aspects for high power density and system approach for a successful market implementation

Abstract

In small to medium size surface combatants there is an increasing need for efficient energy usage, which depends upon power electronics operating in constrained spaces with sensitive equipment. The vision for next generation integrated power systems (NG-IPS) includes MVDC distribution with integrated power conversion, energy storage management and automated fault isolation and recovery. Power conversion and solid state protection technologies are the critical enablers to the accomplishment of the Navy's vision. Wide bandgap power semiconductors enable medium voltage power conversion and protection and simultaneously power dense, efficient and environmentally compatible power supplies. The need for MVDC power distribution is for reliable packaging of modules at high current levels in order meet the power processing demands. The need for ship service loads is a higher level of functionality within a module to reduce risks and costs of technology upgrades. The purpose of this paper is to focus in on three applications to shipboard NG-IPS and identify present and future packaging challenges: (1) low to medium horsepower drives for pumps and fans, (2) medium voltage power converters interfacing into a MVDC distribution system and (3) MVDC solid state protective devices (SSPDs).