Platinum nanometal interconnection of copper–carbon nanotube hybrid electrical conductors

Abstract

This study demonstrates the versatility of Joule heating driven chemical vapor deposition to deposit nanometal interconnections into porous CNT roving with application in the production of high electrical conductivity copper-carbon nanotube (Cu-CNT) hybrids. Modifications of vapor deposition parameters allow for deposited nanometal masses from less than 5% w/w to over 85% w/w and distributions that can be controlled towards either hot-spot site-specificity or overall uniformity. Depositions of copper, platinum, nickel, palladium, ruthenium, rhodium, and iridium are demonstrated from acetylacetonate precursors. In particular, platinum acetylacetonate [Pt(acac)2] deposits nanometal seeds that adhere tightly to the CNT roving, producing improvements in resistance and specific conductivity. The properties of the platinum deposition compared to the copper deposition motivate an investigation into its use as an interfacial layer for Cu-CNT hybrids. CNT conductors with ∼30% w/w platinum are electroplated with copper, densified, and annealed to produce Cu-CNT hybrid conductors with specific conductivities as high as 5772 S m2/kg and TCR (from 300 to 600 K) as low as 3.12 × 10−3 K−1, indicating good interconnection of the metal and CNT portions. Room temperature conductivities of 29.8 MS/m are achieved, comparable to metallic conductors. Thus, Pt(acac)2 seeded Cu-CNT hybrids offer abundant promise in high conductivity applications.