Abstract
The analysis and control of gold plating baths used in the fabrication of electrical components and printed circuit boards were highlighted at the American Electroplaters’ Society’s 9th Symposium on Plating in the Electronics Industry held in Atlanta, GA., on February 16th and 17th, 1982. Electronic systems are becoming more complex with greater packing densities and are operating under stringent conditions. It is therefore becoming increasingly critical to optimize, monitor and control existing plating systems, to develop new materials and, at the same time, to work under environmentally acceptable conditions.
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