Plastic module of laser diode and photodiode mounted on planar lightwave circuit for access network

Abstract

Low-cost plastic packaging of laser diodes and photodiodes mounted on planar lightwave circuit (PLC) platform are developed and its reliability is confirmed under various environmental and endurance tests. The high performance of the module is maintained under reliability tests, such as high-humidity high-temperature tests (85/spl deg/C, 85%RH) and temperature cycling tests (-40/spl deg/C/85/spl deg/C). No laser diodes show any device characteristics change during environmental tests and their stability has very little dependence on current bias. Although the photodiodes show an increase in leakage current under high-temperature high-humidity tests and the rate of leakage current increase is proportional to the square root of bias voltage, the increase is negligible for system use. These plastic modules can be applied to actual access networks and other fiber-optic networks.